日本進口晶圓搬運機械手臂，晶圓對位系統(tǒng)

全自動晶圓貼膜

標置ESD特氟龍電鍍接觸晶片夾盤

應對DBG工藝：貼膜后再撕BG膜

貼膜動作：自動拉膜和貼膜

晶圓臺盤：通用(一體式)特氟龍防靜電涂層接觸式臺盤；或硅膠臺盤，或陶瓷臺盤

Wafer Thickness

150 ~ 725 um

Wafer material

Si, SiC

Wafer Type

Single Flat, Double Flat or V-Notch

Tape Type

Blue Tape or UV Tape

Width :230、300 mm, Length:100 m; Thickness: 0.05 ~ 0.2 mm

Frame Type

6" DISCO or K&S, 8" DISCO or K&S; or Customer Specified

Mounting Theory

Roller Mounting

Wafer Place Accuracy

X-Y: +/- 0. 1 mm    Θ: +/- 0.1°

Input & Output

Dual Input Wafer Cassette / Single Output Frame Cassette

ESD Control

ESD Roller / ESD Wafer Chuck / ESD Ion Blower

Wafer Transfer

Horizontal Multi Axis Robot with Vacuum or Bernoulli Endeffector

Wafer Position & Warpage Intelligent Mapping in Cassette

Wafer Alignment

Fiber Sensor for Wafer Alignment

Control Unit

Standard Industrial PC with 17" Touch Panel LCD / Windows O/S

Power Supplier

Single Phase AC 220 V, 25A

Air Supplier

5.0 Kgf/cm2 CDA, 150 L/min

Machine Construction

Made of Full Aluminium Profile

Dimensions

1750 mm (W) × 1350 mm (D) × 1800 mm (H)

Net Weight

870 Kg